Substrates for Power Modules
High-strength AlN and alumina substrates compatible with direct copper bonding — the base of reliable power modules.
Built to your drawing.
High-strength AlN and alumina substrates compatible with direct copper bonding — the base of reliable power modules.
- Precision grinding to ±0.005 mm, lapping to Ra 0.02 μm
- Prototypes from 1 piece — production volumes welcome
- CMM inspection report & material certificate with every lot
48H ENGINEERING REVIEW :: NDA ON REQUEST
Material options
Not sure which grade fits? Our engineers recommend material and tolerance stack based on your operating conditions — media, temperature, pressure and cycle life.
:: Used In| Forming | Dry pressing / isostatic pressing / injection molding |
|---|---|
| Machining | CNC grinding, lapping, polishing, honing |
| Tolerance | Down to ±0.005 mm on ground features |
| Surface Finish | Ra 0.02–0.05 μm lapped · Ra 0.4–0.8 μm as-fired |
| Max Size | Up to Ø600 mm / 800 mm length |
| Prototypes | From 1 pc — no MOQ for sampling |
| Lead Time | Samples 2–4 weeks · production by volume |
Every lot, documented.
Formed and sintered at our Huzhou base, precision-ground in Huizhou. CMM dimensional report, material certificate and optional SEM imagery ship with your order.
Two ways to reach an engineer.
Send your drawing through the RFQ form for a documented 48-hour review — or WhatsApp us photos and sketches for a same-day first answer.
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