Polished Substrates
Polished substrates with excellent surface smoothness, tight thickness tolerance and flatness for precision electronics.
Built to your drawing.
Polished substrates with excellent surface smoothness, tight thickness tolerance and flatness for precision electronics.
- Precision grinding to ±0.005 mm, lapping to Ra 0.02 μm
- Prototypes from 1 piece — production volumes welcome
- CMM inspection report & material certificate with every lot
48H ENGINEERING REVIEW :: NDA ON REQUEST
Material options
Not sure which grade fits? Our engineers recommend material and tolerance stack based on your operating conditions — media, temperature, pressure and cycle life.
:: Used In| Forming | Dry pressing / isostatic pressing / injection molding |
|---|---|
| Machining | CNC grinding, lapping, polishing, honing |
| Tolerance | Down to ±0.005 mm on ground features |
| Surface Finish | Ra 0.02–0.05 μm lapped · Ra 0.4–0.8 μm as-fired |
| Max Size | Up to Ø600 mm / 800 mm length |
| Prototypes | From 1 pc — no MOQ for sampling |
| Lead Time | Samples 2–4 weeks · production by volume |
Every lot, documented.
Formed and sintered at our Huzhou base, precision-ground in Huizhou. CMM dimensional report, material certificate and optional SEM imagery ship with your order.
Two ways to reach an engineer.
Send your drawing through the RFQ form for a documented 48-hour review — or WhatsApp us photos and sketches for a same-day first answer.
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